PART |
Description |
Maker |
OPA731 OPA731B OPA731BD OPA731G OPA731GD OPA731R O |
20 Watt Light Flood on Anotherm Linear Heat Spreader
|
OPTEK Technologies
|
SMLK19WBEPW11F SMLK19WBECW11F SMLK19 SMLK19WBEAW S |
High heat radiation package from ROHM original flat flame structure
|
Rohm
|
LQFP |
Low Profile Quad Flat Pack
|
STATS ChipPAC, Ltd.
|
AK32D300-QFP5X5 AK32D300-QFP5X512 |
Quad Flat Package DIP or PGA Adapters
|
ACCUTEK MICROCIRCUIT CORPORATION
|
SOT389-1 |
Plastic Low Profile Quad flat Package
|
NXP Semiconductors Philips Semiconductors
|
FPT-64P-M09 |
LOW PROFILE QUAD FLAT PACKAGE 64 PIN PLASTIC 低四方扁平封64引脚塑料
|
Fujitsu, Ltd. Fujitsu Limited Fujitsu Component Limited. FUJITSU[Fujitsu Media Devices Limited] Fujitsu Microelectronics
|
SOT486-1 |
plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
|
NXP Semiconductors
|
FD64 |
64-Pin, Low Profile Quad Flat Package, LQFP From old datasheet system
|
Pericom Semiconductor Corp.
|
NNCD6.8RL |
ESD noise clipping diode 5-pin XSOF (flat lead type) low capactance 5-PIN SUPER SMALL MINI MOLD (FLAT LEAD TYPE) ELECTROSTATIC DISCHARGE NOISE CLIPPING DIODE (QUAD TYPE: COMMON ANODE) 5针超小微型模具(扁平引脚型)静电放电噪声裁剪二极管(四型:共阳极
|
NEC[NEC] NEC Corp. NEC, Corp.
|
SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors PHILIPS[Philips Semiconductors]
|